Modification of the Cu/W Interface Cohesion by Segregation
Cu/W composites are widely used in various industrial fields as they show thermomechanical properties suitable for a wide range of applications. Additionally, in semiconductor products, WTi in contact with Cu acts as a barrier material between Cu and Si/SiO<sub>2</sub>. Therefore, the bonding behavi...
Shranjeno v:
| Principais autores: | , , , |
|---|---|
| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
MDPI AG
2023-02-01
|
| Serija: | Metals |
| Teme: | |
| Online dostop: | https://www.mdpi.com/2075-4701/13/2/346 |
| Oznake: |
Brez oznak, prvi označite!
|