Accelerated Testing and Reliability of FDM-Based Structural Electronics
With the development of the miniaturization of electronic systems, heat dissipation from components has become an increasing challenge. Structural electronics represent a new approach to this problem. Instead of downsizing all the elements, in this idea, electronic parts of the device are embedded i...
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| Principais autores: | , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI AG
2022-01-01
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| Colecção: | Applied Sciences |
| Assuntos: | |
| Acesso em linha: | https://www.mdpi.com/2076-3417/12/3/1110 |
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