Accelerated Testing and Reliability of FDM-Based Structural Electronics
With the development of the miniaturization of electronic systems, heat dissipation from components has become an increasing challenge. Structural electronics represent a new approach to this problem. Instead of downsizing all the elements, in this idea, electronic parts of the device are embedded i...
I tiakina i:
| Ngā kaituhi matua: | , |
|---|---|
| Hōputu: | Artigo |
| Reo: | Inglês |
| I whakaputaina: |
MDPI AG
2022-01-01
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| Rangatū: | Applied Sciences |
| Ngā marau: | |
| Urunga tuihono: | https://www.mdpi.com/2076-3417/12/3/1110 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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