A Selective Deposition Strategy of Ultrathin Metal Layer on Sub‐Micrometer‐Pitch Cu Interconnection for Low‐Temperature Hybrid Bonding

The advancement of high‐performance, miniaturized electronic systems continues to drive the development of advanced semiconductor packaging technologies with high bandwidth and integration density. Among these, sub‐micrometer‐pitch Cu interconnection via Cu/SiO2 hybrid bonding has become a critical...

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Detalhes bibliográficos

Principais autores:	Zambaga Otgonbayar, Jungchul Noh, Seong‐Ho Yoon, Gyu‐Sik Park, Suk Jekal, Jiwon Kim, Jeong‐Hwan Lee, Rino Choi, Jeonghun Kim, Myeongjin Kim, Chang‐Min Yoon
Formato:	Artigo
Idioma:	Inglês
Publicado em:	Wiley-VCH 2026-02-01
coleção:	Small Science
Assuntos:	advanced packaging CuCu metallic bonds electroless deposition hybrid bonding low‐temperature bonding
Acesso em linha:	https://doi.org/10.1002/smsc.202500271
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