The Reliability of SAC305 Individual Solder Joints during Creep–Fatigue Conditions at Room Temperature
The failure of one solder joint out of the hundreds of joints in a system compromises the reliability of the electronics assembly. Thermal cycling is a result of both creep–fatigue mechanisms working together. To better understand the failure process in thermal cycling, it is crucial to analyze both...
I tiakina i:
| Ngā kaituhi matua: | , , , |
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| Hōputu: | Artigo |
| Reo: | Inglês |
| I whakaputaina: |
MDPI AG
2022-09-01
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| Rangatū: | Crystals |
| Ngā marau: | |
| Urunga tuihono: | https://www.mdpi.com/2073-4352/12/9/1306 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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