Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model
Abstract Reliability of the microelectronic interconnection materials for electronic packages has a significant impact on the fatigue properties of the electronic assemblies. This is due to the correlation between solder joints reliability and the most frequent failure modes seen in electronic devic...
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| Principais autores: | , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Portfolio
2023-02-01
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| coleção: | Scientific Reports |
| Acesso em linha: | https://doi.org/10.1038/s41598-023-29636-3 |
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