Simulation on the Interfacial Singular Stress-strain Induced Cracking of Microelectronic Chip Under pPower On-off Cycles
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| Hovedforfatter: | |
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| Format: | Artigo |
| Sprog: | Inglês |
| Udgivet: |
MIDEM Society - Society for Microelectronics, Electronic Components and Materials
2019-09-01
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| Serier: | Informacije MIDEM |
| Fag: | |
| Online adgang: | http://www.midem-drustvo.si/Journal%20papers/MIDEM_49(2019)2p69.pdf |
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