Through Silicon MEMS Inspection with a Near-Infrared Laser Scanning Setup
The inspection of encapsulated MEMS devices typically relies on destructive methods which compromise the structural integrity of samples. In this work, we present the concept and preliminary experimental validation of a laser scanning setup to non-destructively inspect silicon-encapsulated microstru...
-д хадгалсан:
| Үндсэн зохиолчид: | , , , , , |
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| Формат: | Artigo |
| Хэл сонгох: | Inglês |
| Хэвлэсэн: |
MDPI AG
2025-07-01
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| Цуврал: | Sensors |
| Нөхцлүүд: | |
| Онлайн хандалт: | https://www.mdpi.com/1424-8220/25/15/4627 |
| Шошгууд: |
Шошго байхгүй, Энэхүү баримтыг шошголох эхний хүн болох!
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