Grain-boundary diffusion in Cu and Ni films with thin metal coating

Investigation results of the grain-boundary diffusion in Сu films with thin Ni coating and in Ni films with thin Cu coating by the low-temperature resistometric method are presented in this work. It is shown that during the coating deposition and thermal annealing the irreversible increase in the el...

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Autores principales:	T.P. Hovorun, S.I. Protsenko, V.A. Pchelintsev, A.M. Chornous
Formato:	Artigo
Lenguaje:	Inglês
Publicado:	Sumy State University 2009-01-01
Colección:	Журнал нано- та електронної фізики
Materias:	Grain-Boundary Diffusion Diffusion Processes Grain Boundary Thin Coating Average Grain Size
Acceso en línea:	http://jnep.sumdu.edu.ua/download/numbers/2009/4/articles/en/jnep_eng_2009_V1_N4_90-100.pdf
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