Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”
As fabrication technologies advance, the packaging of MEMS device is being developed in two main directions: MEMS device packaging and MEMS or sensor system integration [...]
I tiakina i:
| Kaituhi matua: | |
|---|---|
| Hōputu: | Artigo |
| Reo: | Inglês |
| I whakaputaina: |
MDPI AG
2022-05-01
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| Rangatū: | Micromachines |
| Ngā marau: | |
| Urunga tuihono: | https://www.mdpi.com/2072-666X/13/5/749 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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