Enhanced damping and thermal conductivity of hBN/silicone rubber composites via strong interfacial action

High integration and miniaturization of electronic systems require thermal conductivity and mechanical damping materials. In this study, hexagonal boron nitride ( h BN) particles were modified by vinyltrimethoxysilane (V171) and hexadecyltrimethoxysilane (N3116) for comparing, and described as V171-...

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Detalles Bibliográficos

Principais autores:	Fengmei Ren, Zizheng Yang, Haihong Ma, Zhengfa Zhou, Weibing Xu
Formato:	Artigo
Idioma:	Inglês
Publicado:	IOP Publishing 2022-01-01
Series:	Materials Research Express
Assuntos:	hexagonal boron nitride damping thermal conductivity silicone rubber composites
Acceso en liña:	https://doi.org/10.1088/2053-1591/ac648d
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