Microstructure, interfacial reaction and shearing property of Sn-58Bi solder joints reinforced by Zn particles during isothermal aging
In this paper, micro-sized Zn particles were added into Sn-58Bi solder flux to form Sn-58Bi-xZn composite solder. The evolution of microstructure, interfacial IMCs and shearing properties during long-term aging were investigated. The wettability of Sn-58Bi-xZn solder decreased with the increase in Z...
Wedi'i Gadw mewn:
| Prif Awduron: | , , , , , |
|---|---|
| Fformat: | Artigo |
| Iaith: | Inglês |
| Cyhoeddwyd: |
Frontiers Media S.A.
2025-03-01
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| Cyfres: | Frontiers in Materials |
| Pynciau: | |
| Mynediad Ar-lein: | https://www.frontiersin.org/articles/10.3389/fmats.2025.1581900/full |
| Tagiau: |
Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!
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