Effects of Residual Stress Distribution on Interfacial Adhesion of Magnetron Sputtered AlN and AlN/Al Nanostructured Coatings on a (100) Silicon Substrate

The present study investigated the influence of nanoscale residual stress depth gradients on the nano-mechanical behavior and adhesion energy of aluminium nitride (AlN) and Al/AlN sputtered thin films on a (100) silicon substrate. By using a focused ion beam (FIB) incremental ring-core method, the r...

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Hlavní autoři:	Rashid Ali, Marco Renzelli, M. Imran Khan, Marco Sebastiani, Edoardo Bemporad
Médium:	Artigo
Jazyk:	Inglês
Vydáno:	MDPI AG 2018-11-01
Edice:	Nanomaterials
Témata:	physical vapor deposition magnetron sputtering AlN/Al coating silicon substrate residual stresses wafer curvature method nanoscale residual stress profiling indentation failure modes nanoindentation adhesion
On-line přístup:	https://www.mdpi.com/2079-4991/8/11/896
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