Sub-micron silver wires on non-planar polymer substrates fabricated by thermal nanoimprint and back injection molding

In back injection molding, a polymer film (most commonly a decorative label) is inserted into the mold and fused with the polymer product by injection of the polymer melt from behind. By placing a bendable film into a mold cavity and by injection of polymer melt, the film conforms to the outlines of...

Täydet tiedot

Bibliografiset tiedot

Päätekijät:	Sijia Xie, Barbara Horváth, Jerome Werder, Helmut Schift
Aineistotyyppi:	Artigo
Kieli:	Inglês
Julkaistu:	Elsevier 2020-08-01
Sarja:	Micro and Nano Engineering
Aiheet:	Printed flexible electronics Silver nanoparticles Conductive ink Nanoimprint lithography V-groove capillaries Back injection molding
Linkit:	http://www.sciencedirect.com/science/article/pii/S2590007220300174
Tagit:	Lisää tagi Ei tageja, Lisää ensimmäinen tagi!