Improvement for Interfacial Microstructure and Mechanical Properties of Ti<sub>3</sub>SiC<sub>2</sub>/Cu Joint Brazed by Ag-Cu-Ti Filler with Copper Mesh
Ti<sub>3</sub>SiC<sub>2</sub> ceramic and copper were successfully vacuum brazed using Ag-Cu-Ti filler and Ag-Cu-Ti filler with copper mesh, respectively. In this study, the effects of copper mesh and brazing parameters on the interface microstructure and mechanical properties of the joints were sys...
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| Hauptverfasser: | , , , , , , |
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| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
MDPI AG
2021-04-01
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| Schriftenreihe: | Crystals |
| Schlagworte: | |
| Online-Zugang: | https://www.mdpi.com/2073-4352/11/4/401 |
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