Research Progress on the Interfacial Modification Strategies and Interfacial Heat Transfer Mechanisms in Diamond/Copper Composites
With the rapid development of information technology and the increasing integration of electronic devices，the thermal management performance of electronic packaging materials faces higher requirements.Diamond/copper composites have attracted considerable attention due to their potential high thermal...
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| Autor principal: | |
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| Format: | Artigo |
| Idioma: | Chinês |
| Publicat: |
Editorial Department of Materials Protection
2025-09-01
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| Col·lecció: | Cailiao Baohu |
| Matèries: | |
| Accés en línia: | http://www.mat-pro.com/fileup/1001-1560/PDF/20250901.pdf |
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