Research Progress on the Interfacial Modification Strategies and Interfacial Heat Transfer Mechanisms in Diamond/Copper Composites

With the rapid development of information technology and the increasing integration of electronic devices，the thermal management performance of electronic packaging materials faces higher requirements.Diamond/copper composites have attracted considerable attention due to their potential high thermal...

Повний опис

Бібліографічні деталі

Автор:	LIU Yufei, XU Bin, LIU Yue
Формат:	Artigo
Мова:	Chinês
Опубліковано:	Editorial Department of Materials Protection 2025-09-01
Серія:	Cailiao Baohu
Предмети:	diamond/copper composites；interfacial thermal conductivity；interfacial modification；thermal conductivity
Онлайн доступ:	http://www.mat-pro.com/fileup/1001-1560/PDF/20250901.pdf
Теги:	Додати тег Немає тегів, Будьте першим, хто поставить тег для цього запису!