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Highly Stable Self-Aligned Ni-InGaAs and Non-Self-Aligned Mo Contact for Monolithic 3-D Integration of InGaAs MOSFETs

Self-heating has emerged as an important performance/reliability challenge for modern MOSFETs. The challenge is further acerbated for III-V transistors, especially when integrated monolithically in a 3-D platform for applications in ultrafast logic, imagers, etc. A key challenge is the difficulty of...

Täydet tiedot

Tallennettuna:
Bibliografiset tiedot
Päätekijät: Sanghyeon Kim, Seong Kwang Kim, Sanghoon Shin, Jae-Hoon Han, Dae-Myeong Geum, Jae-Phil Shim, Subin Lee, Hansung Kim, Gunwu Ju, Jin Dong Song, M. A. Alam, Hyung-Jun Kim
Aineistotyyppi: Artigo
Kieli:Inglês
Julkaistu: IEEE 2019-01-01
Sarja:IEEE Journal of the Electron Devices Society
Aiheet:
Linkit:https://ieeexplore.ieee.org/document/8676035/
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