Mechanical properties, thermal conductivity, and modeling of boron nitride-based polymer composites: A review

In the past, polymer materials have been used in electronic devices; however, the major drawback with polymers is their low thermal conductivity, i.e., 0.1–0.5 W/(m・K). Hence, researchers came up with the idea of incorporating conductive fillers into the polymer matrix in order to increase their the...

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Hlavní autoři:	T. E. Mokoena, S. I. Magagula, M. J. Mochane, T. C. Mokhena
Médium:	Artigo
Jazyk:	Inglês
Vydáno:	Budapest University of Technology and Economics 2021-12-01
Edice:	eXPRESS Polymer Letters
Témata:	polymer composites hybrid conductive fillers thermal conductivity conductive fillers boron nitride
On-line přístup:	http://www.expresspolymlett.com/letolt.php?file=EPL-0011442&mi=cd
Tagy:	Přidat tag Žádné tagy, Buďte první, kdo vytvoří štítek k tomuto záznamu!