Mechanical properties, thermal conductivity, and modeling of boron nitride-based polymer composites: A review

In the past, polymer materials have been used in electronic devices; however, the major drawback with polymers is their low thermal conductivity, i.e., 0.1–0.5 W/(m・K). Hence, researchers came up with the idea of incorporating conductive fillers into the polymer matrix in order to increase their the...

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Autori principali:	T. E. Mokoena, S. I. Magagula, M. J. Mochane, T. C. Mokhena
Natura:	Artigo
Lingua:	Inglês
Pubblicazione:	Budapest University of Technology and Economics 2021-12-01
Serie:	eXPRESS Polymer Letters
Soggetti:	polymer composites hybrid conductive fillers thermal conductivity conductive fillers boron nitride
Accesso online:	http://www.expresspolymlett.com/letolt.php?file=EPL-0011442&mi=cd
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