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A New Method of Press Mounting for Press-pack Power Semiconductor

It analyzes the advantages and disadvantages of press mounting methods for press-pack power semiconductor, and presents a new press mounting method for power semiconductor. The feasibility of new method was verified by results of mechanical simulation and real operation, and can make it more conveni...

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Bibliográfalaš dieđut
Váldodahkkit: SUN Baotao, LI Yanyong
Materiálatiipa: Artigo
Giella:Chinês
Almmustuhtton: Editorial Office of Control and Information Technology 2013-01-01
Ráidu:Kongzhi Yu Xinxi Jishu
Fáttát:
Liŋkkat:http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2013.04.001
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