A New Method of Press Mounting for Press-pack Power Semiconductor
It analyzes the advantages and disadvantages of press mounting methods for press-pack power semiconductor, and presents a new press mounting method for power semiconductor. The feasibility of new method was verified by results of mechanical simulation and real operation, and can make it more conveni...
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| Autori principali: | , |
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| Natura: | Artigo |
| Lingua: | Chinês |
| Pubblicazione: |
Editorial Office of Control and Information Technology
2013-01-01
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| Serie: | Kongzhi Yu Xinxi Jishu |
| Soggetti: | |
| Accesso online: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2013.04.001 |
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