An improved layer by layer TSV assignment optimization for multi-layer 3-D ICs
Poor TSV assignment algorithm leads to a large detour of wire-length.Some of the previous works deal with TSV assignment problem using layer-by-layer methods(LBL) only gets local optimal results.In this research work,a backward layer-by-layer reassignment(BRLBL) is developed to do further optimizati...
Gorde:
| Egile Nagusiak: | , , , |
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| Formatua: | Artigo |
| Hizkuntza: | Inglês |
| Argitaratua: |
Academic Journals Center of Shanghai Normal University
2016-04-01
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| Saila: | 上海师范大学学报. 自然科学版 |
| Gaiak: | |
| Sarrera elektronikoa: | http://qktg.shnu.edu.cn/zrb/shsfqkszrb/ch/reader/create_pdf.aspx?file_no=201602010&flag=1&year_id=2016&quarter_id=2 |
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