Código QR (código de barras bidimensional)

Effect of Co particle content on microstructure and properties of SnBi/Cu joints

The microstructure of Sn35Bi-xCo(x=0%, 0.3%, 0.7%, 1.0%, 1.2%, 1.5%, mass fraction) composite solder/Cu joints was observed by scanning electron microscopy (SEM).Combined energy spectrum (EDS) and XRD analysis, the difference of joint structure was studied. The mechanical properties of joints were t...

ver descrição completa

Na minha lista:
Principais autores: LI Zhengbing, LI Haitao, GUO Yile, CHEN Yiping, CHENG Donghai, HU Dean, GAO Junhao, LI Dongyang
Formato: Artigo
Idioma:Chinês
Publicado em: Journal of Materials Engineering 2022-07-01
coleção:Cailiao gongcheng
Assuntos:
sn35bi solder
co particle
wettability
microstructure
mechanical property
Acesso em linha:http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2020.001151
Tags: Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!

Registros relacionados