Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation

The integration of assembled foils in injection-molded parts is a challenging step. Such assembled foils typically comprise a plastic foil on which a circuit board is printed and electronic components are mounted. Those components can detach during overmolding when high pressures and shear stresses...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής

Κύριοι συγγραφείς:	Martin Hubmann, Mona Bakr, Jonas Groten, Martin Pletz, Jan Vanfleteren, Frederick Bossuyt, Behnam Madadnia, Barbara Stadlober
Μορφή:	Artigo
Γλώσσα:	Inglês
Έκδοση:	MDPI AG 2023-04-01
Σειρά:	Micromachines
Θέματα:	injection molding simulation in-mold electronics over-molding Moldflow
Διαθέσιμο Online:	https://www.mdpi.com/2072-666X/14/4/876
Ετικέτες:	Προσθήκη ετικέτας Δεν υπάρχουν, Καταχωρήστε ετικέτα πρώτοι!