Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation
The integration of assembled foils in injection-molded parts is a challenging step. Such assembled foils typically comprise a plastic foil on which a circuit board is printed and electronic components are mounted. Those components can detach during overmolding when high pressures and shear stresses...
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| Principais autores: | , , , , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado: |
MDPI AG
2023-04-01
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| Series: | Micromachines |
| Assuntos: | |
| Acceso en liña: | https://www.mdpi.com/2072-666X/14/4/876 |
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