Correlation Between Electromechanical Impedance and Thermal Analysis for Adhesive Cure Time Evaluation in SHM GW Applications

Piezoelectric ultrasonic sensors used in Structural Health Monitoring (SHM) systems are usually attached to components by using adhesives with intrinsic properties that end up affecting their frequency-response. In this work, the electromechanical impedance of sensors attached to an aluminum sheet w...

Ausführliche Beschreibung

Bibliografische Detailangaben

Hauptverfasser:	R. C. Jacques, L. A. Corrêa, C. A. Ferreira, T. G. R. Clarke
Format:	Artigo
Sprache:	Inglês
Veröffentlicht:	Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol) 2024-10-01
Schriftenreihe:	Materials Research
Schlagworte:	Adhesive electromechanical impedance change index
Online-Zugang:	http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392024000100294&lng=en&tlng=en
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