Glass-Based 4-in-1 High-Voltage Micro-LED Package for High-Brightness Mini-LED Backlight Applications

A novel four-in-one (4-in-series) MicroLED-in-Package (MiP4) architecture is demonstrated for the first time, integrating four sub-85 µm blue micro-LED (µ-LED) dies on a transparent glass substrate through a redistribution-layer (RDL) interconnection process. The MiP4 device operates natively at 16...

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Auteurs principaux:	Chien-Chi Huang, Tzu-Yi Lee, Chia-Hung Tsai, Fang-Chung Chen, Li-Yin Chen, Hao-Chung Kuo
Format:	Artigo
Langue:	Inglês
Publié:	MDPI AG 2025-12-01
Collection:	Nanomaterials
Sujets:	MicroLED-in-Package (MiP4) redistribution layer (RDL) glass substrate packaging
Accès en ligne:	https://www.mdpi.com/2079-4991/15/23/1818
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