Glass-Based 4-in-1 High-Voltage Micro-LED Package for High-Brightness Mini-LED Backlight Applications
A novel four-in-one (4-in-series) MicroLED-in-Package (MiP4) architecture is demonstrated for the first time, integrating four sub-85 µm blue micro-LED (µ-LED) dies on a transparent glass substrate through a redistribution-layer (RDL) interconnection process. The MiP4 device operates natively at 16...
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| Autors principals: | , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
MDPI AG
2025-12-01
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| Col·lecció: | Nanomaterials |
| Matèries: | |
| Accés en línia: | https://www.mdpi.com/2079-4991/15/23/1818 |
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