Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions
The mechanical and fatigue properties of microelectronic interconnection materials are important issues in critical applications in the life of electronic assemblies. Due to the growth in the applications of electronic components in new technological products used in tough conditions, evaluating the...
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| Autori principali: | , , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
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MDPI AG
2022-05-01
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| Serie: | Crystals |
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| Accesso online: | https://www.mdpi.com/2073-4352/12/6/775 |
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