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Sensitivity Analysis of SAC 305 Solder Polycrystal Mechanical Parameters and Predicted Fatigue Lifetime with Different Grain Structures

The microstructural behaviours of solder joints during thermomechanical stresses are still not fully understood, and the thermomechanical reliability of solder joints remains a research area for scientists. In many cases, the solder material is modelled as a homogeneous material in Finite Element-ba...

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Principais autores: Antal Bakonyi, Levente Bodnár, Ambrus Zelei
Format: Artigo
Sprog:Inglês
Udgivet: MDPI AG 2026-01-01
Serier:Applied Sciences
Fag:
solder joint
microstructure
crystal plasticity
crystal grain orientation
fatigue lifetime model
Online adgang:https://www.mdpi.com/2076-3417/16/2/704
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