Sensitivity Analysis of SAC 305 Solder Polycrystal Mechanical Parameters and Predicted Fatigue Lifetime with Different Grain Structures

The microstructural behaviours of solder joints during thermomechanical stresses are still not fully understood, and the thermomechanical reliability of solder joints remains a research area for scientists. In many cases, the solder material is modelled as a homogeneous material in Finite Element-ba...

Descripció completa

Dades bibliogràfiques

Autors principals:	Antal Bakonyi, Levente Bodnár, Ambrus Zelei
Format:	Artigo
Idioma:	Inglês
Publicat:	MDPI AG 2026-01-01
Col·lecció:	Applied Sciences
Matèries:	solder joint microstructure crystal plasticity crystal grain orientation fatigue lifetime model
Accés en línia:	https://www.mdpi.com/2076-3417/16/2/704
Etiquetes:	Afegir etiqueta Sense etiquetes, Sigues el primer a etiquetar aquest registre!