Process-integrated in-situ characterization and multiscale modeling of cure-dependent thermo-mechanical behavior of epoxy molding compounds for accurate warpage prediction in advanced semiconductor packaging

Accurate prediction of cure-induced thermo-mechanical deformation in polymer-based composites critically depends on reliable characterization of material property evolution under process-relevant curing conditions. For warpage prediction in advanced semiconductor packages, a liquid-type, highly sili...

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Autors principals:	Jeong-Hyeon Baek, Woong-Kyoo Yoo, Woo-Jin An, Jun-Seop Song, Gyung-Hwan Oh, Ji-Hye Shim, Hak-Sung Kim
Format:	Artigo
Idioma:	Inglês
Publicat:	Elsevier 2026-06-01
Col·lecció:	Materials Today Advances
Matèries:	Cure-dependent properties Epoxy molding compound (EMC) Fiber Bragg grating (FBG) sensing Molecular dynamics (MD) Warpage prediction
Accés en línia:	http://www.sciencedirect.com/science/article/pii/S2590049826000962
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