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High aspect ratio silicon ring-shape micropillars fabricated by deep reactive ion etching with sacrificial structures

This paper presents the fabrication of widely-spaced high aspect ratio ring-shape pillars (i.e. hollow pillars). Lateral etching of the pillars during deep reactive ion etching is challenging. To reduce this problem, we proposed adding sacrificial structures surrounding the pillars such that the lat...

Ausführliche Beschreibung

Gespeichert in:
Hauptverfasser: Wenhan Hu, Zihao Wang, Aixi Pan, Bo Cui
Format: Artigo
Sprache:Inglês
Veröffentlicht: Elsevier 2024-03-01
Schriftenreihe:Micro and Nano Engineering
Schlagworte:
Sacrificial structure
DRIE
Etching
High aspect ratio
Online-Zugang:http://www.sciencedirect.com/science/article/pii/S2590007223000643
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