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Pinhole formation and its mitigation for Cu electrodeposition on the Ajinomoto build-up film (ABF) with different surface roughnesses

In this study, the roughness effects of an Ajinomoto build-up film (ABF) on the crystallographic microstructure and corrosion characteristics of electroplated Cu were systematically investigated via scanning electron microscopy (SEM) in conjunction with electron backscatter diffraction (EBSD), trans...

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Principais autores: Pei-Chia Hsu, Zhao-Yu Yang, Chi Lee, Cheng-En Ho, Chih-Ming Chen, Yu-An Shen
פורמט: Artigo
שפה:Inglês
יצא לאור: Elsevier 2025-05-01
סדרה:Journal of Materials Research and Technology
נושאים:
Electroplated Cu
Pinhole
ABF roughness
Twin boundaries
Cu microstructure
5G/6G
גישה מקוונת:http://www.sciencedirect.com/science/article/pii/S2238785425006106
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