Numerical study on the effect of thermal pad on enhancing interfacial heat transfer considering thermal contact resistance
In this paper, a 3D numerical model was established to investigate the effect of thermal pad on enhancing heat transfer of rough contact interfaces. The model is a sandwich structure and it includes chip, thermal pad and heat sink. The results indicate that the elastic modulus of the thermal pad can...
שמור ב:
| Principais autores: | , , , , , |
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| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
Elsevier
2023-09-01
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| סדרה: | Case Studies in Thermal Engineering |
| נושאים: | |
| גישה מקוונת: | http://www.sciencedirect.com/science/article/pii/S2214157X23005324 |
| תגים: |
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