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Preparation of W-Plated Diamond and Improvement of Thermal Conductivity of Diamond-WC-Cu Composite

The tungsten (W)-plated diamond process was explored and optimized. A dense and uniform tungsten coating with a thickness of 900 nm was successfully prepared by the powder covering sintering method. The Diamond-WC-Cu composite with high density and high thermal conductivity were successfully prepare...

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Principais autores: Xulei Wang, Xinbo He, Zhiyang Xu, Xuanhui Qu
פורמט: Artigo
שפה:Inglês
יצא לאור: MDPI AG 2021-03-01
סדרה:Metals
נושאים:
diamond-WC-Cu composite
cyclic vacuum pressure infiltration
thermal conductivity
interface thermal resistance
גישה מקוונת:https://www.mdpi.com/2075-4701/11/3/437
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