Preparation of W-Plated Diamond and Improvement of Thermal Conductivity of Diamond-WC-Cu Composite

The tungsten (W)-plated diamond process was explored and optimized. A dense and uniform tungsten coating with a thickness of 900 nm was successfully prepared by the powder covering sintering method. The Diamond-WC-Cu composite with high density and high thermal conductivity were successfully prepare...

Täydet tiedot

Bibliografiset tiedot

Päätekijät:	Xulei Wang, Xinbo He, Zhiyang Xu, Xuanhui Qu
Aineistotyyppi:	Artigo
Kieli:	Inglês
Julkaistu:	MDPI AG 2021-03-01
Sarja:	Metals
Aiheet:	diamond-WC-Cu composite cyclic vacuum pressure infiltration thermal conductivity interface thermal resistance
Linkit:	https://www.mdpi.com/2075-4701/11/3/437
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