Broadband Dielectric Properties and Temperature Effects of Silicone Gel for IGBT Device Encapsulation

Silicone gel materials are used as packaging material for IGBT devices. Under the operating conditions, the devices are subjected to a repetitive on-off voltage which corresponds to the wide spectrum, and the device loss will cause temperature rise. In order to accurately analyze the internal electr...

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Xehetasun bibliografikoak

Egile Nagusiak:	Yuan MAO, Xuebao LI, Jiayu XU, Zhibin ZHAO, Xiang CUI
Formatua:	Artigo
Hizkuntza:	Chinês
Argitaratua:	State Grid Energy Research Institute 2020-12-01
Saila:	Zhongguo dianli
Gaiak:	silicone gel broadband dielectric properties temperature cole-cole model characteristic parameter
Sarrera elektronikoa:	https://www.electricpower.com.cn/CN/10.11930/j.issn.1004-9649.202007124
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