Broadband Dielectric Properties and Temperature Effects of Silicone Gel for IGBT Device Encapsulation
Silicone gel materials are used as packaging material for IGBT devices. Under the operating conditions, the devices are subjected to a repetitive on-off voltage which corresponds to the wide spectrum, and the device loss will cause temperature rise. In order to accurately analyze the internal electr...
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| Principais autores: | , , , , |
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| פורמט: | Artigo |
| שפה: | Chinês |
| יצא לאור: |
State Grid Energy Research Institute
2020-12-01
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| סדרה: | Zhongguo dianli |
| נושאים: | |
| גישה מקוונת: | https://www.electricpower.com.cn/CN/10.11930/j.issn.1004-9649.202007124 |
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