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Broadband Dielectric Properties and Temperature Effects of Silicone Gel for IGBT Device Encapsulation

Silicone gel materials are used as packaging material for IGBT devices. Under the operating conditions, the devices are subjected to a repetitive on-off voltage which corresponds to the wide spectrum, and the device loss will cause temperature rise. In order to accurately analyze the internal electr...

תיאור מלא

שמור ב:
מידע ביבליוגרפי
Principais autores: Yuan MAO, Xuebao LI, Jiayu XU, Zhibin ZHAO, Xiang CUI
פורמט: Artigo
שפה:Chinês
יצא לאור: State Grid Energy Research Institute 2020-12-01
סדרה:Zhongguo dianli
נושאים:
גישה מקוונת:https://www.electricpower.com.cn/CN/10.11930/j.issn.1004-9649.202007124
תגים: הוספת תג
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