Fabrication of Polyimide/Aluminum Nitride Composites and Wafer Channel Filling via Direct Ink Writing

The emergence of three-dimensional heterogeneous integration (3D HI) has pushed forward the development of chip-to-wafer (C2W) hybrid bonding technology. To mitigate stress concentration during thermal annealing and wafer thinning processes of C2W bonding, a direct ink writing (DIW)-based 3D printin...

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Bibliografiske detaljer

Principais autores:	Junjie Xiao, Qingjie Shan, Zhoulong Xu, Zhouping Yin, Bin Xie, Hao Wu
Format:	Artigo
Sprog:	Inglês
Udgivet:	MDPI AG 2026-05-01
Serier:	Nanomaterials
Fag:	PI/AlN composite ink coefficient of thermal expansion direct ink writing (DIW) technology thermal stability wafer channels filling
Online adgang:	https://www.mdpi.com/2079-4991/16/11/681
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