Fabrication of Polyimide/Aluminum Nitride Composites and Wafer Channel Filling via Direct Ink Writing

The emergence of three-dimensional heterogeneous integration (3D HI) has pushed forward the development of chip-to-wafer (C2W) hybrid bonding technology. To mitigate stress concentration during thermal annealing and wafer thinning processes of C2W bonding, a direct ink writing (DIW)-based 3D printin...

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Autori principali:	Junjie Xiao, Qingjie Shan, Zhoulong Xu, Zhouping Yin, Bin Xie, Hao Wu
Natura:	Artigo
Lingua:	Inglês
Pubblicazione:	MDPI AG 2026-05-01
Serie:	Nanomaterials
Soggetti:	PI/AlN composite ink coefficient of thermal expansion direct ink writing (DIW) technology thermal stability wafer channels filling
Accesso online:	https://www.mdpi.com/2079-4991/16/11/681
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