Dual heterogeneity design in high-strength Cu–Ti alloys via powder metallurgy for enhanced ductility and conductivity

The development of high-strength Cu alloys is constrained by an inherent trade-off between mechanical strength and functional properties such as ductility and electrical conductivity. To overcome this limitation, we report a Cu–Ti alloy with a deliberately engineered dual-heterogeneous architecture...

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Podrobná bibliografie

Hlavní autoři:	Weijie Qiang, Xiang Zhang, Zhihang Xu, Dongdong Zhao, Xudong Rong, Chunsheng Shi, Chunnian He, Naiqin Zhao
Médium:	Artigo
Jazyk:	Inglês
Vydáno:	Taylor & Francis Group 2026-06-01
Edice:	Materials Research Letters
Témata:	Cu–Ti alloy powder metallurgy dual heterogeneity ductility electrical conductivity
On-line přístup:	https://www.tandfonline.com/doi/10.1080/21663831.2026.2651932
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