Dual heterogeneity design in high-strength Cu–Ti alloys via powder metallurgy for enhanced ductility and conductivity
The development of high-strength Cu alloys is constrained by an inherent trade-off between mechanical strength and functional properties such as ductility and electrical conductivity. To overcome this limitation, we report a Cu–Ti alloy with a deliberately engineered dual-heterogeneous architecture...
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| Hoofdauteurs: | , , , , , , , |
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| Formaat: | Artigo |
| Taal: | Inglês |
| Gepubliceerd in: |
Taylor & Francis Group
2026-06-01
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| Reeks: | Materials Research Letters |
| Onderwerpen: | |
| Online toegang: | https://www.tandfonline.com/doi/10.1080/21663831.2026.2651932 |
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