Fabrication of high thermal conductivity Cu/diamond composites at ambient temperature and pressure
High thermal conductivity Cu/diamond composites were produced at ambient temperature and pressure using an electrodeposition technique, employing various diamond particle sizes in the range of 10 to 230 μm. The microstructures of the resulting composites were analyzed by scanning electron microscopy...
Guardat en:
| Autors principals: | , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
AIP Publishing LLC
2019-08-01
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| Col·lecció: | AIP Advances |
| Accés en línia: | http://dx.doi.org/10.1063/1.5111416 |
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