Thermal Heating in ReRAM Crossbar Arrays: Challenges and Solutions
The high speed, scalability, and parallelism offered by ReRAM crossbar arrays foster the development of ReRAM-based next-generation AI accelerators. At the same time, the sensitivity of ReRAM to temperature variations decreases <inline-formula> <tex-math notation="LaTeX">$\text{R}_{ON}/\text{R}_{OFF...
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| Autores principales: | , , |
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| Formato: | Artigo |
| Lenguaje: | Inglês |
| Publicado: |
IEEE
2024-01-01
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| Colección: | IEEE Open Journal of Circuits and Systems |
| Materias: | |
| Acceso en línea: | https://ieeexplore.ieee.org/document/10416883/ |
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