Role of mechanical stress on the electrothermal and OFF state current in scaled FinFET devices
Abstract The electrothermal characteristics and leakage current of a tall FinFET device were investigated using the hydrodynamic transport model coupled with a quantum-corrected diffusive transport mechanism-based TCAD simulation. The effects of strain on the electrothermal characteristics and the g...
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| Autori principali: | , |
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| Natura: | Artigo |
| Lingua: | Inglês |
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Nature Portfolio
2026-04-01
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| Serie: | Scientific Reports |
| Soggetti: | |
| Accesso online: | https://doi.org/10.1038/s41598-026-46949-1 |
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