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Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering

In this study, the properties of solder joints were compared after bonding process using different energy sources. Various soldering methods were employed, including reflow, laser, and Intense Pulsed Light (IPL) soldering. When reflow soldering was performed for a relatively long time, coarse solder...

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Principais autores: Eun-Chae Noh, Hyo-Won Lee, Jong-Woong Kim, Seung-Boo Jung, Jeong-Won Yoon
Format: Artigo
Sprog:Inglês
Udgivet: Elsevier 2024-11-01
Serier:Journal of Materials Research and Technology
Fag:
Reflow soldering
Laser soldering
Intense pulsed light (IPL) soldering
Intermetallic compounds
Shear test
Online adgang:http://www.sciencedirect.com/science/article/pii/S2238785424025213
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