Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks
With the rapid development of 3D packaging, it is of great practical significance to understand the failure mechanism of solder joints in heterogeneous integration devices. In this study, the grain orientation and microstructure evolution of SAC305 solder joints were investigated in thermal shock te...
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| Principais autores: | , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Elsevier
2023-09-01
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| Colecção: | Journal of Materials Research and Technology |
| Assuntos: | |
| Acesso em linha: | http://www.sciencedirect.com/science/article/pii/S2238785423018367 |
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