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A Highly Sensitive Multimodal Tactile Sensing Module with Planar Structure for Dexterous Manipulation of Robots

Herein, a multimodal tactile sensing module that can improve the dexterous manipulation capabilities of robots with parallel grippers is reported. The tactile sensor consists of a 4 × 4 matrix 3‐axis force sensor array (with spacings of 2 mm) and a single‐temperature sensor. The tactile sensor uses...

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Gorde:
Xehetasun bibliografikoak
Egile Nagusiak: Bo-Gyu Bok, Jin-Seok Jang, Min-Seok Kim
Formatua: Artigo
Hizkuntza:Inglês
Argitaratua: Wiley 2023-06-01
Saila:Advanced Intelligent Systems
Gaiak:
Sarrera elektronikoa:https://doi.org/10.1002/aisy.202200381
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